What happens if the nickel is 1.5 to 3 microns?
Regards,
George
George M. Wenger
Senior Principal Reliability / FMA Engineer
Andrew Corporation - Wireless Network Solutions
40 Technology Drive, Warren, NJ 07059
(908) 546-4531 Office (732) 309-8964 Mobile
E-mail: [log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Anil kher
Sent: Friday, June 10, 2011 3:38 AM
To: [log in to unmask]
Subject: Re: [TN] Black Pad?
We found an easy method to determine Black Pad. Check under an XRF with
Gold/ nickel calibration.
If no black pad the nickel will be ~ 3 to 5 microns. Wherever the nickel
goes down to 1/1.5 microns and gold shows same - sure u hv black pad.
Of course - that is how black pad is formed. But well in the hole - a cross
section will be better.
Its also the layout which causes black pad - we observed some pads with very
low nickel and the same would not solder. Nearby bigger pads showed adequate
Ni and soldered well.
My 2 bits
Anil Kher
-----Original Message-----
From: Gerry Gagnon [mailto:[log in to unmask]]
Sent: Thursday, June 09, 2011 11:19 PM
Subject: Re: Black Pad?
Me too. It looks like oxidized nickel which will not wet.
> Date: Thu, 9 Jun 2011 09:12:00 -0700
> From: [log in to unmask]
> Subject: Re: [TN] Black Pad?
> To: [log in to unmask]
>
> I'm with Steve on this one...
>
> Paul
>
> Paul Edwards
> Process/Quality Engineering
> Surface Art Engineering
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
> Sent: Thursday, June 09, 2011 6:59 AM
> To: [log in to unmask]
> Subject: Re: [TN] Black Pad?
>
> Hi Gary,
>
> I got your pictures this morning, and have them posted now:
>
> http://stevezeva.homestead.com/Joint_1.JPG
>
> http://stevezeva.homestead.com/Joint_2.JPG
>
> http://stevezeva.homestead.com/via.JPG
>
> Although the pictures show some non-wetting happening, it's difficult to
see
> what exactly is going on.
>
> You say that the component side seems fine, it's just when you're trying
to
> wave solder is when you see the problem. Maybe you have thin gold, and
when
> the boards were fresh, the SMT was able to solder fine. But then after the
> boards went through reflow, the underlying nickel oxidized so badly that
> solder wasn't able to wet?
>
> Steve
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Gary Robinson
> Sent: Wednesday, June 08, 2011 4:46 PM
> To: [log in to unmask]
> Subject: [TN] Black Pad?
>
> We have noticed a problem only on ENIG boards in our WAVE process that
looks
> similar to Black Pad but do not know how to identify or where to begin to
> find a resolution to the problem. We were hoping an expert may have
> experience in seeing this problem. Here are some facts -
> 1. Black residue is on the vias and thts on the solder side. Please see
the
> attached images.
> 2. Component Side SMT Parts do not exhibit the same problems.
> 3. Boards are processed PbFree - SAC305, Pacific 2009m No Clean Water
Based
> flux
> 4. THTs will not wet after residues appear (for touch up process)
> 5. Blowholes appear to accompany the defect but are not always present.
>
> Thanks for your help in advance.
>
>
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