We have noticed a problem only on ENIG boards in our WAVE process that looks
similar to Black Pad but do not know how to identify or where to begin to
find a resolution to the problem.  We were hoping an expert may have
experience in seeing this problem.  Here are some facts -
1.  Black residue is on the vias and thts on the solder side. Please see the
attached images.
2.  Component Side SMT Parts do not exhibit the same problems.
3.  Boards are processed PbFree - SAC305, Pacific 2009m No Clean Water Based
flux
4.  THTs will not wet after residues appear (for touch up process)
5.  Blowholes appear to accompany the defect but are not always present.

Thanks for your help in advance.


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