Steve,
I agree with your assessment about possible oxidation of Ni 1st pass and dewetting during wave soldering.
Regards,
George
George M. Wenger
Senior Principal Reliability / FMA Engineer
Andrew Corporation - Wireless Network Solutions
40 Technology Drive, Warren, NJ 07059
(908) 546-4531 Office (732) 309-8964 Mobile
E-mail: [log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Thursday, June 09, 2011 9:59 AM
To: [log in to unmask]
Subject: Re: [TN] Black Pad?
Hi Gary,
I got your pictures this morning, and have them posted now:
http://stevezeva.homestead.com/Joint_1.JPG
http://stevezeva.homestead.com/Joint_2.JPG
http://stevezeva.homestead.com/via.JPG
Although the pictures show some non-wetting happening, it's difficult to see
what exactly is going on.
You say that the component side seems fine, it's just when you're trying to
wave solder is when you see the problem. Maybe you have thin gold, and when
the boards were fresh, the SMT was able to solder fine. But then after the
boards went through reflow, the underlying nickel oxidized so badly that
solder wasn't able to wet?
Steve
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gary Robinson
Sent: Wednesday, June 08, 2011 4:46 PM
To: [log in to unmask]
Subject: [TN] Black Pad?
We have noticed a problem only on ENIG boards in our WAVE process that looks
similar to Black Pad but do not know how to identify or where to begin to
find a resolution to the problem. We were hoping an expert may have
experience in seeing this problem. Here are some facts -
1. Black residue is on the vias and thts on the solder side. Please see the
attached images.
2. Component Side SMT Parts do not exhibit the same problems.
3. Boards are processed PbFree - SAC305, Pacific 2009m No Clean Water Based
flux
4. THTs will not wet after residues appear (for touch up process)
5. Blowholes appear to accompany the defect but are not always present.
Thanks for your help in advance.
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