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June 2011

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Subject:
Re: Plugged & Tented Vias Under MELF's
From:
Reuven Rokah <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Reuven Rokah <[log in to unmask]>
Date:
Sun, 19 Jun 2011 22:28:55 +0300
Content-Type:
text/plain
Parts/Attachments:
text/plain (76 lines) 
1.  Change layout
2.  Via cap filling
3.  Plugging from one side only (component side).

Reuven

On Fri, Jun 17, 2011 at 7:59 PM, Richard D. Krug <[log in to unmask]> wrote:

> We've got a customer's PWB that has vias with the barrel either coated with
> solder mask or epoxy filled, then covered with solder mask.  The plugging
> tends to leave a small protrusion above the copper surface.  Some of these
> locations happen to be centered at MELF locations.  During reflow, MELF's
> shift off the high point.
>
> Prevention / mitigation ideas anyone?
>
>
> Dick Krug, SSBB, CSMTPE
> SMT Process Engineer
> Sparton Corporation
> 30167 Power Line Road
> Brooksville, FL  34602-8299
> p (352) 540-4012  (Internal Ext. 2012)
> [log in to unmask]
>
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-- 

Best Regards,

*Reuven Rokah*

Mobile: 972-52-60-120-18
Tele-fax: 97239360688
<http://www.rokah-technologies.com/>[log in to unmask]
[log in to unmask]
www.rokah-technologies.com

**


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