Sender: |
|
X-To: |
|
Date: |
Thu, 16 Jun 2011 14:33:48 +0300 |
Reply-To: |
|
Message-ID: |
|
Subject: |
|
From: |
|
Content-Transfer-Encoding: |
quoted-printable |
In-Reply-To: |
<A936A174CF909F4984A47611248BE1A94FA980A20C@exchangeserv> |
Content-Type: |
text/plain; charset="UTF-8"; format=flowed |
MIME-Version: |
1.0 |
Parts/Attachments: |
|
|
If I understand what you are trying to do, there is a strong chance you
may be disappointed. To do cleanliness testing, you simply cannot change
the base material because the hydrogen bonding and adsorption
characteristics of the contaminants will be different. To take extreme
examples: FR-4 and borosilicate glass. Because FR-4 is organic and the
glass is inorganic, the glass will normally be cleaner, as the flux
residues will be organic. Then the FR-4 does not have a smooth surface,
which the glass does, making physical adhesion stronger with the FR-4
because of the greater surface area. The FR-4 surface is porous and the
pores open when passing the glass transition temperature of the epoxy
substrate, allowing contaminants to be trapped in the first µm or two of
the surface. Glass does not have a porous surface to the same extent.
Sorry if I have the wrong end of the stick.
Many, many years ago, I came across a thick, transparent,
non-reinforced, copper-clad laminate made from a styrene copolymer. It
was designed for precise low-loss reflection-free microwave
applications. I remember that it cost an arm and a leg but I cannot
recall the details. I can't remember the manufacturer (Rogers Corp.?????)
Brian
On 16/06/2011 10:16, Lars Wallin wrote:
> Hello All of You,
>
> Does anyone of you know anyone who can manufacture the following types of boards?
>
> Volume: 200.
> Size: 100 by 100 mm
> Layer: 1.
> Base Material: Transparent (This is a must)
> Thickness: 2-3 mm.
> Solder mask: Green.
> Surface finish: At your choice.
> Delivery time: Short.
> Gerber files for Cu pads and tracks plus solder mask will be supplied.
>
>
> Best Regards
> Lars Wallin
> IPC European Representative
> Location: Stockholm, Sweden
> Phone: +46 8 26 10 07
> Mobile: +46 70 212 74 39
> Email: [log in to unmask]<mailto:[log in to unmask]>
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 16.0
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
> -----------------------------------------------------
>
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 16.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|