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May 2011

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Subject:
IPC as Technical Sponsor for ASQED 2011, Kuala Lumpur, Malaysia
From:
IPC as Technical Sponsor ASQED 2011 <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, IPC as Technical Sponsor ASQED 2011 <[log in to unmask]>
Date:
Wed, 25 May 2011 14:55:38 +0800
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Dear industry colleagues,

Just a short note to inform you that IPC is a technical sponsor for ASQED 2011, 19-20 July, Kuala Lumpur, Malaysia.
The following are highlights from this Symposium, followed by a 2 days HDI High Density Interconnect workshop. 

Program at a Glance includes various keynotes and tutorials.  This year is the 3rd year and the focus is on Advanced IC Packaging,
Substrates and PCB Technologies.   The symposium has invited several leading international experts to share their knowledge and 
experience with us.   Do join us for this exciting symposium !  We are now open for registrations, early bird discount at RM 1300 is 
available until  *10 June. 

For full details: 
www.asqed.com  or www.shrdc.org.my 

See you there! 

Contact us for more information:  [log in to unmask] 
 or +603-55133560 





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