Joey I thought it was a typo too! I don't have anything requiring 6015
but if it was 6016 which uses reference documents (section 2) this
includes 6012, 6013 and 6015 anything that is not covered in 6016 we
revert back to the applicable document - of course if it is listed in
6016 then 6016 would take precedence. Not sure if 6015 has the same
reference paragraph.
Denise
Denise J Chevalier
Amphenol Printed Circuits
Quality Engineer
Phone - 603-324-4530
Fax - 603-386-6442
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-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Reed,
Randy
Sent: Friday, March 11, 2011 2:15 PM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] bga workmanship criteria for 6015 designs
Joey, OK. I thought the 6015 was a mistype.
Randy
Randy Reed, CQE
Reliability Lab
Viasystems Group Inc.
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-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Jose A
Rios
Sent: Friday, March 11, 2011 10:25 AM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] bga workmanship criteria for 6015 designs
randy, the 3.5.3.2 i refer to is 6015, not 6012.
Joey Rios
PWB & Process Quality Eng'r
Endicott Interconnect Technologies
1093 Clark St.
Endicott, NY 13760
Office: 607-755-5896
"Reed, Randy" <[log in to unmask]>
Sent by: IPC-600-6012 <[log in to unmask]>
03/11/2011 01:19 PM
Please respond to
"(Combined Forum of D-33a and 7-31a Subcommittees)"
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To
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cc
Subject
Re: [IPC-600-6012] bga workmanship criteria for 6015 designs
Hi Joey,
For IPC-6012 -
1) 3.5.3.2 is conductor thickness and is applied global to the board
surface.
2) 3.5.4.2.2 states for round surface mount pads the global statement in
3.5.3.2 does not apply to the pristine area of the pad.
I view 3.5.4.2.2 as an exception to 3.5.3.2.
Randy
Randy Reed, CQE
Reliability Lab
Viasystems Group Inc.
[log in to unmask]
503.992.4421-direct l 503.545.0150-cell
-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Jose A
Rios
Sent: Thursday, March 10, 2011 9:41 AM
To: [log in to unmask]
Subject: [IPC-600-6012] bga workmanship criteria for 6015 designs
Wondering how some of you would evaluate workmanship of round surface
mount lands (BGA's, non-wirebond) for designs calling out fabrication
and
inspection per IPC 6015 only , and the User does not know what AABUS
means....
The closest thing I come to is IPC 6015 paragraph 3.5.3.2, however it's
not written in a 'round' context and the boundaries of the edge vs
internal area are not explicitely stated.
Do I then go to 6012, 3.5.4.2.2 ???
Joey Rios
PWB & Process Quality Eng'r
Endicott Interconnect Technologies
1093 Clark St.
Endicott, NY 13760
Office: 607-755-5896
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