Xiaofeng Ren，您好！
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在 2011-01-24 09:33:08 您写道：
>諸位，
>
>无铅制程的工艺，打上了有铅的BGA，如何返修 才符合RoSH标准。
>尝试过如下方法，然后在焊盘上做RoHS测试，结果不合格，请问还有其它方法吗？
>用高温胶纸将第一排与第二排的via孔，只空出一排焊盘，
>然后烙铁和无铅锡线在焊盘上加锡，使锡与焊盘充分焊接，每个焊盘加锡焊接2次，
>然后用烙铁和吸锡线将焊盘上的锡全部吸走。再加锡(焊接2次)→吸锡→加锡(焊接2次)→吸锡。
>即每排焊盘加无铅锡/吸锡共3个来回。
>[cid:[log in to unmask]]
>Xiaofeng Ren | SMT Process Engineer | Embedded Computing & Power | ZhongShan
>Emerson Network Power | No. 45, Qi Guan Road West, Shiqi District | ZhongShan City, Guangdong 528400 China
>T +86 760 88923578 5909 | M +86 13531800900 | F +86 760 88865513
>www.Emerson.com/EmbeddedComputing<http://www.emerson.com/EmbeddedComputing> | www.Emerson.com/EmbeddedPower<http://www.emerson.com/EmbeddedPower>
>
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                    致
礼！

            Angela
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