There are several previous threads on this forum about this subject.
We have had this process qualified for a single BGA on a single pcb with
a certain reflow profile.
That profile produced complete reflow of the ball with no interface
between the alloys, there was a new hybrid alloy ball.
NPL published a report which is still on their website which showed good
results for the conditions of their experiment.
There were certainly negative feelings from others on the forum.
Regards
Rex

Rex Waygood
Technical Manager
 
Hansatech EMS provides value manufacturing through engineering and
quality
 
Hansatech EMS Limited
Benson Road
Nuffield Industrial Estate
Poole
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dee Stover
Sent: 10 June 2010 15:13
To: [log in to unmask]
Subject: [TN] rohs, BGAs & assembly

Hi all,

I need to find some written data on the long term reliability of rohs
assemblies.  We don't have comply with rohs but can only get the parts
in rohs, with BGA's being the main drive for rohs compliant solder.

Just had an assembly vendor say that a rohs bga can be assembled with
eutectic solder paste with good results.  2 other assembly shops say
that is not recommended.  Is there any real studies or data available
that provides the real answer?  Also studies and data for the
reliability of rohs?  We need our boxes to work for 10 years or more.

Thank you for your time.   What a great network for people to share 
knowledge.  I will also be going through PCD&F and google to (hopelessly
behind on my reading)

:-) Dee Stover  [log in to unmask]   520-318-8489
Tech Associate II
National Optical Astronomy Observatories www.noao.edu 



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