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Subject:	Re: rohs, BGAs & assembly
From:	Nigel Burtt <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Nigel Burtt <[log in to unmask]>
Date:	Thu, 10 Jun 2010 10:32:39 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (17 lines)

Will be OK providing your assembly can withstand high enough reflow 
temperature to get the RoHS balls to melt. usually problem is not with the 
BGA, but with other parts that won't like to get that hot!

NPL in the UK have public domain technical papers on this which you can 
download from their website 

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