Jack,
I hate the phenolic boards. If for Tg reasons (temperature rating), you can stay with a good FR4 board, do so. But as Dewey said, that has nothing to do with RoHS. Tetrabromobisphenol A is NOT a member of one of the two restricted (essentially banned) families of brominate fire retardants.
Bev
----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Tue May 18 17:41:34 2010
Subject: Re: [TN] My first RoHS circuit board!
Jack,
Just designing for RoHS compliance does not dictate the use of non-dicey
cured material. If you are designing a fully compliant, complex,
Lead-free design that will be exposed to a minimum of two lead-free
reflow profiles and one wave solder operation and expect it to work for
twenty plus years, then no dicey-cured FR4 shall apply. IPC-4101/126 and
/129 are phenolic cured materials which have demonstrated a robustness
that is up to the challenge.
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson
Sent: Tuesday, May 18, 2010 2:29 PM
To: [log in to unmask]
Subject: [TN] My first RoHS circuit board!
Well, we avoided it as long as we could, but now I have to design for
RoHS
compliance.
I'm basically following Werner's recommendations (which don't conflict
with
anyone else's as far as I know), but I'm confused about one aspect of
material:
Several sources have stated that its better to use "NON-DICEY" material,
but
none of the IPC-4101 slash sheets mention dicy or non-dicy (or
dicyandiamide).
If we are trying /126 material, do we still have to specify non-dicy?
thanks,
Jack
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