Jack, I hate the phenolic boards. If for Tg reasons (temperature rating), you can stay with a good FR4 board, do so. But as Dewey said, that has nothing to do with RoHS. Tetrabromobisphenol A is NOT a member of one of the two restricted (essentially banned) families of brominate fire retardants. Bev ----- Original Message ----- From: TechNet <[log in to unmask]> To: [log in to unmask] <[log in to unmask]> Sent: Tue May 18 17:41:34 2010 Subject: Re: [TN] My first RoHS circuit board! Jack, Just designing for RoHS compliance does not dictate the use of non-dicey cured material. If you are designing a fully compliant, complex, Lead-free design that will be exposed to a minimum of two lead-free reflow profiles and one wave solder operation and expect it to work for twenty plus years, then no dicey-cured FR4 shall apply. IPC-4101/126 and /129 are phenolic cured materials which have demonstrated a robustness that is up to the challenge. Dewey -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson Sent: Tuesday, May 18, 2010 2:29 PM To: [log in to unmask] Subject: [TN] My first RoHS circuit board! Well, we avoided it as long as we could, but now I have to design for RoHS compliance. I'm basically following Werner's recommendations (which don't conflict with anyone else's as far as I know), but I'm confused about one aspect of material: Several sources have stated that its better to use "NON-DICEY" material, but none of the IPC-4101 slash sheets mention dicy or non-dicy (or dicyandiamide). If we are trying /126 material, do we still have to specify non-dicy? thanks, Jack ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. 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