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May 2010

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TechNet E-Mail Forum <[log in to unmask]>, Don McFarland <[log in to unmask]>
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Tue, 4 May 2010 16:54:06 -0400
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TechNet E-Mail Forum <[log in to unmask]>, Louis Hart <[log in to unmask]>
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Louis Hart <[log in to unmask]>
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Don, A book I have from 1998, Failure Modes and Mechanisms in Electronic Packages, by Viswanadham and Singh, addresses solder balling in a few pages. (At least one of these gentlemen was a Technetter about 10 years ago, I believe.) Among their observations, glossy mask is said, supported by  a reference, to promote solder ball formation.

Louis Hart

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Don McFarland
Sent: Tuesday, May 04, 2010 4:20 PM
To: [log in to unmask]
Subject: [TN] Does solder mask specified create solder balls?

Hi Technetters, 

I was asked to perform a DOE to determine if there was a correlation
between solder mask types and the rate at which we see solder balls
develop on the PWB surface. I searched through the archives and found a
few articles from the mid-90s about this topic, but couldn't glean
anything exciting from the posts reviewed. I am wondering if anyone knows
of a good source of information that addresses this topic or has anything
that would be useful for us. 

We have made a number of changes to other process variables (e.g. stencil
apertures, solder pastes, paste viscosity, profiles, etc) and have seen
good results, but we wanted to rule this out as a causal factor as well. 

Any help is greatly appreciated!

Don McFarland
  

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