Don, A book I have from 1998, Failure Modes and Mechanisms in Electronic Packages, by Viswanadham and Singh, addresses solder balling in a few pages. (At least one of these gentlemen was a Technetter about 10 years ago, I believe.) Among their observations, glossy mask is said, supported by a reference, to promote solder ball formation.
Louis Hart
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Don McFarland
Sent: Tuesday, May 04, 2010 4:20 PM
To: [log in to unmask]
Subject: [TN] Does solder mask specified create solder balls?
Hi Technetters,
I was asked to perform a DOE to determine if there was a correlation
between solder mask types and the rate at which we see solder balls
develop on the PWB surface. I searched through the archives and found a
few articles from the mid-90s about this topic, but couldn't glean
anything exciting from the posts reviewed. I am wondering if anyone knows
of a good source of information that addresses this topic or has anything
that would be useful for us.
We have made a number of changes to other process variables (e.g. stencil
apertures, solder pastes, paste viscosity, profiles, etc) and have seen
good results, but we wanted to rule this out as a causal factor as well.
Any help is greatly appreciated!
Don McFarland
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|