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Don,
I haven't met yet solderballing in SMT process that I could not eliminate through proper stencil apertures (reduction, homeplating, etc.).
Regards,
Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask]
W | www.digico.cc
N'imprimer que si nécessaire - Print only if you must
-----Message d'origine-----
De : Don McFarland [mailto:[log in to unmask]]
Envoyé : May-04-10 4:20 PM
À : [log in to unmask]
Objet : [TN] Does solder mask specified create solder balls?
Hi Technetters,
I was asked to perform a DOE to determine if there was a correlation
between solder mask types and the rate at which we see solder balls
develop on the PWB surface. I searched through the archives and found a
few articles from the mid-90s about this topic, but couldn't glean
anything exciting from the posts reviewed. I am wondering if anyone knows
of a good source of information that addresses this topic or has anything
that would be useful for us.
We have made a number of changes to other process variables (e.g. stencil
apertures, solder pastes, paste viscosity, profiles, etc) and have seen
good results, but we wanted to rule this out as a causal factor as well.
Any help is greatly appreciated!
Don McFarland
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