It should be added, that the less the vias, the higher a risk of lowering 
the reliability in high temperature operating.
(Predicting PTH Reliability in high temp Manufacturing/ Ray Iannuzzelli at 
DEC, old one, but still actual, according to our CADers )
If it's a single layer only, I suppose there is no such problems.  What 
product is the one you ask for
Inge

--------------------------------------------------
From: "Inge" <[log in to unmask]>
Sent: den 31 March 2010 12:52
To: <[log in to unmask]>
Subject: Re: [TN] Wire bondable gold

> Hi Steve,
>  electroless gold has the ability of much better selective deposition than 
> has electrolytic. Maybe they have need for a precise start and then 
> followed by the more compact electrolytic gold for the thermosonic 
> bonding.
>
> Inge
>
> --------------------------------------------------
> From: "Steve Kelly" <[log in to unmask]>
> Sent: den 31 March 2010 12:20
> To: <[log in to unmask]>
> Subject: [TN] Wire bondable gold
>
>> Hi all,
>>
>> Anyone know a reason why a customer would call up 20 micro inches of 
>> electroless gold followed by 50 micro inches of electroplated soft gold 
>> for thermosonic gold wire bonding? Is there an advantage to having the 
>> electroless underneath?
>>
>> Regards Steve Kelly
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>> PFC_2col.png
>>
>> CREATING A FLEXIBLE FUTURE
>>
>>
>>
>> Steve Kelly
>>
>> (416) 750-8433 (work)
>>
>> (416) 750-0016 (fax)
>>
>> (416) 577-8433 (cell)
>>
>>
>>
>>
>> ---------------------------------------------------
>> Technet Mail List provided as a service by IPC using LISTSERV 15.0
>> To unsubscribe, send a message to [log in to unmask] with following text in
>> the BODY (NOT the subject field): SIGNOFF Technet
>> To temporarily halt or (re-start) delivery of Technet send e-mail to 
>> [log in to unmask]: SET Technet NOMAIL or (MAIL)
>> To receive ONE mailing per day of all the posts: send e-mail to 
>> [log in to unmask]: SET Technet Digest
>> Search the archives of previous posts at: 
>> http://listserv.ipc.org/archives
>> Please visit IPC web site 
>> http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional 
>> information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 
>> ext.2815
>> ----------------------------------------------------- 
>
>
> ______________________________________________________________________
> This email has been scanned by the MessageLabs Email Security System.
> For more information please contact helpdesk at x2960 or [log in to unmask] 
> ______________________________________________________________________
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to 
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to 
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 
> for additional information, or contact Keach Sasamori at [log in to unmask] or 
> 847-615-7100 ext.2815
> -----------------------------------------------------  


______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------