It should be added, that the less the vias, the higher a risk of lowering the reliability in high temperature operating. (Predicting PTH Reliability in high temp Manufacturing/ Ray Iannuzzelli at DEC, old one, but still actual, according to our CADers ) If it's a single layer only, I suppose there is no such problems. What product is the one you ask for Inge -------------------------------------------------- From: "Inge" <[log in to unmask]> Sent: den 31 March 2010 12:52 To: <[log in to unmask]> Subject: Re: [TN] Wire bondable gold > Hi Steve, > electroless gold has the ability of much better selective deposition than > has electrolytic. Maybe they have need for a precise start and then > followed by the more compact electrolytic gold for the thermosonic > bonding. > > Inge > > -------------------------------------------------- > From: "Steve Kelly" <[log in to unmask]> > Sent: den 31 March 2010 12:20 > To: <[log in to unmask]> > Subject: [TN] Wire bondable gold > >> Hi all, >> >> Anyone know a reason why a customer would call up 20 micro inches of >> electroless gold followed by 50 micro inches of electroplated soft gold >> for thermosonic gold wire bonding? Is there an advantage to having the >> electroless underneath? >> >> Regards Steve Kelly >> >> >> >> >> >> >> >> >> >> >> >> >> >> PFC_2col.png >> >> CREATING A FLEXIBLE FUTURE >> >> >> >> Steve Kelly >> >> (416) 750-8433 (work) >> >> (416) 750-0016 (fax) >> >> (416) 577-8433 (cell) >> >> >> >> >> --------------------------------------------------- >> Technet Mail List provided as a service by IPC using LISTSERV 15.0 >> To unsubscribe, send a message to [log in to unmask] with following text in >> the BODY (NOT the subject field): SIGNOFF Technet >> To temporarily halt or (re-start) delivery of Technet send e-mail to >> [log in to unmask]: SET Technet NOMAIL or (MAIL) >> To receive ONE mailing per day of all the posts: send e-mail to >> [log in to unmask]: SET Technet Digest >> Search the archives of previous posts at: >> http://listserv.ipc.org/archives >> Please visit IPC web site >> http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional >> information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 >> ext.2815 >> ----------------------------------------------------- > > > ______________________________________________________________________ > This email has been scanned by the MessageLabs Email Security System. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > ----------------------------------------------------- ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------