I guess not given the length of time they have been in use..I saw the first one in use at apple Cork in 1995
"David D. Hillman" <[log in to unmask]> wrote:
>Hi John - given that a wide variety of materials make up a component
>construction, isn't there a fairly high risk of damaging a component if
>you transmit the laser heat thru the package?
>
>Dave Hillman
>Rockwell Collins
>[log in to unmask]
>
>
>
>
>John Burke <[log in to unmask]>
>Sent by: TechNet <[log in to unmask]>
>02/03/2010 04:21 PM
>Please respond to
>TechNet E-Mail Forum <[log in to unmask]>; Please respond to
>John Burke <[log in to unmask]>
>
>
>To
>[log in to unmask]
>cc
>
>Subject
>Re: [TN] Laser soldering of BGA
>
>
>
>
>
>
>Yes actually I have used it many times.
>
>The transmission is through the package from the top of the device (don?t
>try it with a heat spreader or metal lid!) and the laser is set up to scan
>up and down the ball pattern on the board continuously.
>
>Since the transmission of the selected frequency (usually prime frquency
>YAG) is at 1.06somthing micron wavelength, the thermal uptake of the
>package
>is from mempory about 20% the rest being concentrated in the joints.
>
>There are a number of machines available for doing this but very expensive
>and usually for re-work not for placement.
>
>Of course you could reflow that part from the other side of the substrate
>using the same technique, but I have a question which is:
>
>Why not use a "normal" reflow syatem"??
>
>
>John Burke
>(408) 515 4992
>
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Thayer, Wayne - IIW
>Sent: Wednesday, February 03, 2010 2:07 PM
>To: [log in to unmask]
>Subject: Re: [TN] Laser soldering of BGA
>
>OK, I've played with using a laser for soldering, but could you share how
>the laser light manages to get to the ball beneath a BGA?
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Kelly
>Sent: Wednesday, February 03, 2010 4:53 PM
>To: [log in to unmask]
>Subject: Re: [TN] Laser soldering of BGA
>
>Hi Ioan,
>What I know about laser soldering would not fit on the back of a postage
>stamp but as far as the BGA and flex if the stiffener is FR-4 I suspect
>you
>will have to underfill unless it is in a very benign environment -
>otherwise
>use a metal stiffener.
>Regards Steve Kelly
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
>Sent: February-03-10 2:35 PM
>To: [log in to unmask]
>Subject: [TN] Laser soldering of BGA
>
>Dear Technos,
>
>
>
>Any insights on BGA laser soldering? It is for soldering a 15x15 mm BGA
>onto
>a flex PCB. The flex is backed by a rigid substrate in the BGA zone, but
>due
>to mechanical constraints this substrate cannot be thicker than 0.012".
>
>
>
>Oh yes, lead-free.
>
>
>
>Thanks,
>
>
>
>Ioan Tempea, ing.
>Ingénieur Principal de Fabrication / Senior Manufacturing Engineer T |
>450.967.7100 ext.244 E | [log in to unmask] <mailto:[log in to unmask]> W |
>www.digico.cc <http://www.digico.cc/>
>
>
> N'imprimer que si nécessaire - Print only if you must
>
>
>
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