I guess not given the length of time they have been in use..I saw the first one in use at apple Cork in 1995 "David D. Hillman" <[log in to unmask]> wrote: >Hi John - given that a wide variety of materials make up a component >construction, isn't there a fairly high risk of damaging a component if >you transmit the laser heat thru the package? > >Dave Hillman >Rockwell Collins >[log in to unmask] > > > > >John Burke <[log in to unmask]> >Sent by: TechNet <[log in to unmask]> >02/03/2010 04:21 PM >Please respond to >TechNet E-Mail Forum <[log in to unmask]>; Please respond to >John Burke <[log in to unmask]> > > >To >[log in to unmask] >cc > >Subject >Re: [TN] Laser soldering of BGA > > > > > > >Yes actually I have used it many times. > >The transmission is through the package from the top of the device (don?t >try it with a heat spreader or metal lid!) and the laser is set up to scan >up and down the ball pattern on the board continuously. > >Since the transmission of the selected frequency (usually prime frquency >YAG) is at 1.06somthing micron wavelength, the thermal uptake of the >package >is from mempory about 20% the rest being concentrated in the joints. > >There are a number of machines available for doing this but very expensive >and usually for re-work not for placement. > >Of course you could reflow that part from the other side of the substrate >using the same technique, but I have a question which is: > >Why not use a "normal" reflow syatem"?? > > >John Burke >(408) 515 4992 > > >-----Original Message----- >From: TechNet [mailto:[log in to unmask]] On Behalf Of Thayer, Wayne - IIW >Sent: Wednesday, February 03, 2010 2:07 PM >To: [log in to unmask] >Subject: Re: [TN] Laser soldering of BGA > >OK, I've played with using a laser for soldering, but could you share how >the laser light manages to get to the ball beneath a BGA? > >-----Original Message----- >From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Kelly >Sent: Wednesday, February 03, 2010 4:53 PM >To: [log in to unmask] >Subject: Re: [TN] Laser soldering of BGA > >Hi Ioan, >What I know about laser soldering would not fit on the back of a postage >stamp but as far as the BGA and flex if the stiffener is FR-4 I suspect >you >will have to underfill unless it is in a very benign environment - >otherwise >use a metal stiffener. >Regards Steve Kelly > >-----Original Message----- >From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea >Sent: February-03-10 2:35 PM >To: [log in to unmask] >Subject: [TN] Laser soldering of BGA > >Dear Technos, > > > >Any insights on BGA laser soldering? It is for soldering a 15x15 mm BGA >onto >a flex PCB. The flex is backed by a rigid substrate in the BGA zone, but >due >to mechanical constraints this substrate cannot be thicker than 0.012". > > > >Oh yes, lead-free. > > > >Thanks, > > > >Ioan Tempea, ing. >Ingénieur Principal de Fabrication / Senior Manufacturing Engineer T | >450.967.7100 ext.244 E | [log in to unmask] <mailto:[log in to unmask]> W | >www.digico.cc <http://www.digico.cc/> > > > N'imprimer que si nécessaire - Print only if you must > > > > >--------------------------------------------------- >Technet Mail List provided as a service by IPC using LISTSERV 15.0 To >unsubscribe, send a message to [log in to unmask] with following text in the >BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or >(re-start) delivery of Technet send e-mail to >[log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per >day of all the posts: send e-mail to >[log in to unmask]: SET Technet Digest >Search the archives of previous posts at: http://listserv.ipc.org/archives >Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 >for additional information, or contact Keach Sasamori at [log in to unmask] or >847-615-7100 ext.2815 >----------------------------------------------------- > >--------------------------------------------------- >Technet Mail List provided as a service by IPC using LISTSERV 15.0 To >unsubscribe, send a message to [log in to unmask] with following text in the >BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or >(re-start) delivery of Technet send e-mail to [log in to unmask]: SET >Technet >NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send >e-mail to [log in to unmask]: SET Technet Digest Search the archives of >previous posts at: http://listserv.ipc.org/archives Please visit IPC web >site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional >information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 >ext.2815 >----------------------------------------------------- > >This e-mail and any files transmitted with it may be proprietary and are >intended solely for the use of the individual or entity to whom they are >addressed. 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