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Date: | Tue, 16 Feb 2010 12:34:14 -0800 |
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All,
I am looking for some proven ways to measure the actual air gap (e.g., 5
to 30 mils) between a component and its mating thermal pad pedestal
located on a Chassis without cutting up the hardware so I can determine
the actual thermal pad compression once a pad is installed. Using a
model, the theoretical gap can be calculated but I would like to
empirically measure/verify what the gap is and the subsequent pad
compression. Visually, it is hard to tell and not all locations are
visible and, I do not have access to any hardware to cut up, etc.. so I
am looking for a tried and proven method. Some have suggested using a
soft material like putty that will compress and could then be
subsequently measured after disassembly. I have heard rumors of material
designed for this purpose but are unable to find such material. thx
Best Regards,
-Joe M.
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