All, I am looking for some proven ways to measure the actual air gap (e.g., 5 to 30 mils) between a component and its mating thermal pad pedestal located on a Chassis without cutting up the hardware so I can determine the actual thermal pad compression once a pad is installed. Using a model, the theoretical gap can be calculated but I would like to empirically measure/verify what the gap is and the subsequent pad compression. Visually, it is hard to tell and not all locations are visible and, I do not have access to any hardware to cut up, etc.. so I am looking for a tried and proven method. Some have suggested using a soft material like putty that will compress and could then be subsequently measured after disassembly. I have heard rumors of material designed for this purpose but are unable to find such material. thx Best Regards, -Joe M. "This e-mail and any attachments are solely for the use of the addressee and may contain L-3 proprietary information that may also be defined as U.S. Government export controlled technical data. If you are an unintended recipient of this e-mail, use, disclosure or distribution of its content is prohibited. Please notify the sender by return e-mail and immediately delete this message." ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------