Hi Inge,
I do not think the report can be that old. To my understanding HP put out a mandate to its suppliers a little over a year or so ago, that specifies no more that specifies no more than 1.5°C/sec as the maximum cooling rate after solder reflow.
I am not familiar with the report you mention—can you send a copy?
Werner
-----Original Message-----
From: Hernefjord Ingemar <[log in to unmask]>
To: [log in to unmask]
Sent: Wed, Feb 3, 2010 5:10 am
Subject: Re: [TN] [LF] Cooling rates
You mean old report (1999) Final Program Report on Electroless Ni/Immersion Au
Evaluation (64 pages BGA matters ) ? Pat Johnson, Matt Kaufmann, Zequn Mei
/Inge
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: onsdag 3 februari 2010 09:52
To: [log in to unmask]
Subject: Re: [TN] [LF] Cooling rates
Hi All,
Arnaud asked for the reference on the HP document mandating cooling rates not to
exceed 1.5°C/sec.
Turns out, I do not have it. HELP-does anybody have it handy?
Werner
-----Original Message-----
From: Arnaud Grivon <[log in to unmask]>
To: Werner Engelmaier <[log in to unmask]>
Sent: Wed, Feb 3, 2010 3:36 am
Subject: Re: [LF] Cooling rates
Hello Werner,
Fully agree with your warning!
I have had some similar discussions on several opportunities...
I would be very interested if you could send me the HP document setting the
mentioned requirement of 1.5°C/sec. maximum cooling rate. At least, the document
reference and the paragraph inquestion.
Even if I am not in the same industry, problems seen in the consumer market
mostly end up in high-end applications (see head-in-pillow on which HP sent
several warnings).
Best regards,
Arnaud Grivon
Werner Engelmaier a écrit :
> >
> That has no benefit for solder joint reliability and sets up large T-gradients
> causing problems with thermal expansion mismatches.
> Everybody (!) check your cooling rates-H-P has mandated no more than 1.5°C/sec
> for good reason.
> Werner
>
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