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December 2009

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Subject:
From:
henry rekers <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, henry rekers <[log in to unmask]>
Date:
Tue, 1 Dec 2009 16:28:21 -0800
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Hi,
 
I have an application where I need to force a pad to not solder (or at least solder to a consistent thickness) in wave solder.  The pad will eventually recieve a mechanical connection.  I'm trying to design a land that will either skip, or solder to a consistent minimum thickness.  The pad is large about 0.500 by 0.500.  Maybe some sort of a checkerboard, or grid of vias, etc?  The wave is leadfree with sac solder.
 
Selective soldering has already been ruled out due to other design constraints, and I'm also pursuing the idea of peelable mask.
 
Any ideas?
 
Thanks.
 
Henry.


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