At 02:06 PM 12/29/2009, Brooks, Bill wrote:
>What about copper filled vias? I have seen some data on this technology
>where they plate the hole completely shut...
>
>Bill Brooks | Datron World Communications, Inc.
>PCB Designer/Engineer | Office: 760-602-7004| Fax: 760-597-3777 |
>[log in to unmask]
>1808 Aston Avenue, Suite 230, Carlsbad, CA 92008 | www.dtwc.com
You betcha, under the heading of "more annular Cu. :-) Not too
widely available yet and is constrained by max via size and aspect
ratio. At least one of our main suppliers does quite a bit of it --
esp on small buried mechanical drilled vias (saves on need to epoxy
fill and overplate buried vias to make a suitable target for stacking uVias)
@ Joe Lara,
What via size and board thickness you working with?
dw
>Performance You Require. Value You ExpectTM
>
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Dwight Mattix
>Sent: Tuesday, December 29, 2009 12:29 PM
>To: [log in to unmask]
>Subject: Re: [TN] Thermally Conductive & Plated Via Fill
>
>Practically speaking, using "thermal conductive" and "CB100" in the
>same sentence is an oxymoron.
>
>
>Cu ~= 300 w/mK
>Solder, Ormet, et al ~= 25 w/mk
>CB100 ~=3 w/mK
>
>Small amount more annular copper, filling with Ormet paste (not a
>cheaper option though) or filling via in process with solder yields
>much greater increase in thermal conductivity than CB100.
>
>At 11:55 AM 12/29/2009, Joe Lara wrote:
> >Hello TechNetter's,
> >
> >Im currently using Du Ponts "CB-100" Conductive Paste to vill Vias
> >at $400 per 100G. Is
> >there a more affordable way of filling vias that call out to be
> >filled (thermal conductive) and
> >plated?
> >
> >
> >Best Regards,
> >
> >Joe
> >
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