At 02:06 PM 12/29/2009, Brooks, Bill wrote: >What about copper filled vias? I have seen some data on this technology >where they plate the hole completely shut... > >Bill Brooks | Datron World Communications, Inc. >PCB Designer/Engineer | Office: 760-602-7004| Fax: 760-597-3777 | >[log in to unmask] >1808 Aston Avenue, Suite 230, Carlsbad, CA 92008 | www.dtwc.com You betcha, under the heading of "more annular Cu. :-) Not too widely available yet and is constrained by max via size and aspect ratio. At least one of our main suppliers does quite a bit of it -- esp on small buried mechanical drilled vias (saves on need to epoxy fill and overplate buried vias to make a suitable target for stacking uVias) @ Joe Lara, What via size and board thickness you working with? dw >Performance You Require. Value You ExpectTM > > >-----Original Message----- >From: TechNet [mailto:[log in to unmask]] On Behalf Of Dwight Mattix >Sent: Tuesday, December 29, 2009 12:29 PM >To: [log in to unmask] >Subject: Re: [TN] Thermally Conductive & Plated Via Fill > >Practically speaking, using "thermal conductive" and "CB100" in the >same sentence is an oxymoron. > > >Cu ~= 300 w/mK >Solder, Ormet, et al ~= 25 w/mk >CB100 ~=3 w/mK > >Small amount more annular copper, filling with Ormet paste (not a >cheaper option though) or filling via in process with solder yields >much greater increase in thermal conductivity than CB100. > >At 11:55 AM 12/29/2009, Joe Lara wrote: > >Hello TechNetter's, > > > >Im currently using Du Ponts "CB-100" Conductive Paste to vill Vias > >at $400 per 100G. Is > >there a more affordable way of filling vias that call out to be > >filled (thermal conductive) and > >plated? > > > > > >Best Regards, > > > >Joe > > > >--------------------------------------------------- > >Technet Mail List provided as a service by IPC using LISTSERV 15.0 > >To unsubscribe, send a message to [log in to unmask] with following text >in > >the BODY (NOT the subject field): SIGNOFF Technet > >To temporarily halt or (re-start) delivery of Technet send e-mail to > >[log in to unmask]: SET Technet NOMAIL or (MAIL) > >To receive ONE mailing per day of all the posts: send e-mail to > >[log in to unmask]: SET Technet Digest > >Search the archives of previous posts at: >http://listserv.ipc.org/archives > >Please visit IPC web site > >http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional > >information, or contact Keach Sasamori at [log in to unmask] or > >847-615-7100 ext.2815 > >----------------------------------------------------- > >--------------------------------------------------- >Technet Mail List provided as a service by IPC using LISTSERV 15.0 >To unsubscribe, send a message to [log in to unmask] with following text >in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt or (re-start) delivery of Technet send e-mail to >[log in to unmask]: SET Technet NOMAIL or (MAIL) >To receive ONE mailing per day of all the posts: send e-mail to >[log in to unmask]: SET Technet Digest >Search the archives of previous posts at: >http://listserv.ipc.org/archives >Please visit IPC web site >http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional >information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 >ext.2815 >----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------