Hi Vlad - hummm, here might be a few people that would disagree with you 
on that! There are some very good published studies that show a SAC 
solderball in a tin/lead soldering process does not result in good solder 
joint integrity (even if thoroughly mixed) in many High Performance use 
environments. Sorry Vlad but the industry data does not support such a 
general statement.

Dave Hillman
Rockwell Collins
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vladimir Igoshev <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
12/08/2009 07:42 AM
Please respond to
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To
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Subject
Re: [TN] SnPb SOLDER BALLS WITH SAC SOLDER PASTE






Lee,

If both of the alloys will mix thoroughly during re-flow, it shouldn't 
make much of a difference whether you solder SAC balls with the eutectic 
paste, or vise versa.

Regards,

Vladimir


------Original Message------
From: Lee Whiteman
Sender: TechNet
To: [log in to unmask]
Subject: [TN] SnPb SOLDER BALLS WITH SAC SOLDER PASTE
Sent: Dec 8, 2009 08:17

I know about the problems with soldering BGAs with SAC solder balls and 
SnPb solder paste and read plenty of papers pro and con.

I heard about a report where if you solder BGAs with SnPb solder balls 
using SAC solder paste, the resulting solder joint will be unreliable. Has 
anyone heard of anything like that? If there are any cross-sections or 
papers that you can share with me, that would be great.

Thanks again.

Lee Whiteman, PMP
Senior Member Engineering Staff
L-3 Communications East
Telephone: (856) 338-3508
FAX: (856) 338-2906
E-Mail: [log in to unmask]
 




SENTEC
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca

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