Hey there,

I've a q about via fill for LGA, small ones, package 5x5 millimeters and 8 
I/Os, teflon one layer on thick brass back. Heat transfer vias 0.5 mm. How 
do you fill them before mounting the LGAs? Halfways, even or overfilled? If 
the solder volume is too meagre, there will not be a good SJ against the LGA 
heat sink (under side), if you  have too much solder, you may get 
overbridging. There are five vias for the contact with the heat sink, four 
vias in a square and one in the middle. We solder same size of packages with 
J-leads on the same board, and they become perfect, but the LGAs get varying 
result.

/Inge

PS. I regret the deplorable incident in Austin. Bad, very bad in many 
aspects, both socially and politically. The human nature is really 
unpredictable. 

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