Hi Peter,
You give us precious little to go on.
Open Q's—(1) is it a soldering or solderability problem—have you actually formed a SJ, you need more thermal energy soldering to Ni because of the slow dissolution rate; (2) is the NI-plating thick enough or does it get consumed in the soldering; (3) does the Ni-plating have a good metallurgical bond to the actual clip metal.
That external lab should have been able to answer your Q's, but commercial labs typically do not interpret what the found except in relationship to standards—and this is clearly non-standard.
Werner

 

 

-----Original Message-----
From: Peter L <[log in to unmask]>
To: [log in to unmask]
Sent: Fri, Oct 30, 2009 12:54 am
Subject: [TN] Solderability issue with nickel plated battery contacts










Hi technet,

We have run into solderability issues with a major battery clip supplier. The 
battery clips are SMT on the board which then get installed into a remote 
control hand held shell. After SMT reflow the clip will shear off after slight 
push with a finger. External lab analysis (cross sectioning, solderability test) 

indicated internal nickel separations hence the nickel plating process was not 
robust and tightly controlled. After months of investigation we see impoved 
results but still failures.

Has anyone else experienced this type of issue before? We are evaluating 
different options including a change of vendor. Can someone share what they 
have been using in these type of application? Appreciate any comment.

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