Michael -
This link shows the TC 91 committee structure. I am not sure which working group addresses the issue of gold in solder joints. However, I would suspect one of the two Working Groups on test methods. It appears to me the entire TC 91 is meeting in Berlin in October this year. This site lists some meetings in San Jose, USA last year, which I know they held. Also, there were some subcommittee meetings in Grenoble, France in May, which coincided with JISSO meetings, ,which I attended by teleconference. However, this gold in solder is probably not an active item right now, but I don't know. Do you know Walter Huck - I think of Murata, in Germany? I think he is very active in IEC actvities. There is also a link to Dieter Bergman of the US IPC, and he will know for sure the Berlin agenda.
http://www.iec.ch/dyn/www/f?p=102:7:0::::FSP_ORG_ID:1286
Denny Fritz
-----Original Message-----
From: Jeremias, Michael <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, Aug 4, 2009 4:09 am
Subject: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT
Unfortunately, the discussion about the matter is not so serious as the
roblem.
Proceedings in technological quality are not available by (hundreds!) of
ails with ridiculous content but by hard work.
, Who knows the responsible at IEC or TC91, who is able to change it?
. Who is able to make thebchange request?
incerly
Michael Jeremias
ndustrial Engineering (OPPI41)
lectronics Production
(( Defence Electronics
ADS Deutschland GmbH
9077 Ulm
el.: +49 (0) 7 31.3 92-5533
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-----Ursprüngliche Nachricht-----
on: TechNet [mailto:[log in to unmask]] Im Auftrag von Joyce Koo
esendet: Freitag, 31. Juli 2009 19:06
n: [log in to unmask]
etreff: Re: [TN] AW: [TN] AW: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A
OLDER JOINT
Who ever made doc and approved it should get shot at... seriously. Not a Friday
oke.
-----Original Message-----
rom: TechNet [mailto:[log in to unmask]] On Behalf Of Jeremias, Michael
ent: Friday, July 31, 2009 12:17 PM
o: [log in to unmask]
ubject: [TN] AW: [TN] AW: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN20A
OLDER JOINT
Unfortunately it is not (!) a typo from me . The document DIN EN 61191-1
ontains this value 2,5 µm . But I am not confident, that this is low
nough for any process cases so we use for PTH the same rule as above as
entioned below
incerely
Michael Jeremias
-----Ursprüngliche Nachricht-----
on: TechNet [mailto:[log in to unmask]] Im Auftrag von Joyce Koo
esendet: Donnerstag, 30. Juli 2009 12:22
n: [log in to unmask]
etreff: Re: [TN] AW: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER
OINT
Must be a typo. Should be 0.25 micron? 10 micro-inches?
-------------------------
ent using BlackBerry
---- Original Message -----
rom: TechNet <[log in to unmask]>
o: [log in to unmask] <[log in to unmask]>
ent: Thu Jul 30 04:26:14 2009
ubject: [TN] AW: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT
IEC 61191-1
hapter 6.2.2 contains the rules
1,4% Volume Au, < 3% Wt Au in the final solder interconnection
2,5 µm for PTH Wave soldering (I am not confident, that this is low enough
or any process cases so we use for PTH the same rule as above)
You have to take into consideration solder paste volume(stencil-thickness),
etted Au-surface, wetted Au thickness
Own investigations show, that Au brittelness may occure from 1,6% Vol and
eally will occure from 2,3% Vol.
Sincerly
Michael Jeremias
ndustrial Engineering (OPPI41)
lectronics Production
(( Defence Electronics
ADS Deutschland GmbH
9077 Ulm
el.: +49 (0) 7 31.3 92-
5533
ax: +49 (0) 7 31.3 92-73 15
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