Greg and fellow Techies



I am in the process of submitting revisions to solder paste tests  

called up in TM-650 and need your help.



In 2.4.43 Solder Ball - 2.4.45 Wetting and 2.4.46 Spread Tests, we  

need to allow for lead-free alloys. In each of these there is a quoted  

time:



"The reflow shall occur within 20 seconds after the specimen is placed  

in contact with the hot plate."



The recommendation is to include the following:



"For lead-free solder pastes, the reflow time shall occur within 30  

seconds after the specimen is placed in contact with the hot plate."



Does anyone out there in Techieland have any objections to this  

proposed addition to each of these test methods?



Thanks in advance



Regards



Graham Naisbitt

Managing Director



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