Greg and fellow Techies I am in the process of submitting revisions to solder paste tests called up in TM-650 and need your help. In 2.4.43 Solder Ball - 2.4.45 Wetting and 2.4.46 Spread Tests, we need to allow for lead-free alloys. In each of these there is a quoted time: "The reflow shall occur within 20 seconds after the specimen is placed in contact with the hot plate." The recommendation is to include the following: "For lead-free solder pastes, the reflow time shall occur within 30 seconds after the specimen is placed in contact with the hot plate." Does anyone out there in Techieland have any objections to this proposed addition to each of these test methods? Thanks in advance Regards Graham Naisbitt Managing Director E: [log in to unmask] P: +44 12 5252 1500 F: +44 12 5252 1112 W: www.gen3systems.com GEN3 SYSTEMS LIMITED Incorporating Process Support Products Unit B2, Armstrong Mall Southwood Business Park FARNBOROUGH Hampshire GU14 0NR - UK Engineering Reliability in Electronics Registered Number: 4639449 (England & Wales). Registered Office as above. DISCLAIMER : This message is intended only for the use of the individual or entity to which it is addressed and may contain information which is privileged, confidential, proprietary, or exempt from disclosure under applicable law. If you are not the intended recipient or the person responsible for delivering the message to the intended recipient, you are strictly prohibited from disclosing, distributing, copying, or in any way using this message. If you have received this communication in error, please notify the sender and destroy and delete any copies you may have received. Any views or opinions presented in this email are solely those of the author and might not represent those of Gen3 Systems Limited. Although Gen3 Systems Limited has taken reasonable precautions to ensure no viruses present in this email, Gen3 Systems Limited can not accept the responsibility for any loss or damage arising from the use of this email or attachments. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------