TECHNET Archives

April 2009

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Richard Stadem <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Richard Stadem <[log in to unmask]>
Date:
Fri, 10 Apr 2009 08:58:26 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (17 lines)
As I stated in my earlier posting, there are certain epoxies that bond well to 
tin-plated copper. One that I described was pull-tested to 18 lbs before it 
pulled the foil away from the PWB. On the side where the same epoxy was 
used to bond the plated foil to the PWB, parts of the FR-4 substrate came up 
with it.
Of course, this has to be done after reflow.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2