I have NEVER seen decent adhesion between tin or tin-based alloys and a polymer based adhesive.  I've been watching this thread to see if anyone has ever found a way to stick to it.  Seems to me the epoxy companies gave up on that 10 years ago when they saw the market opportunity to have conductive adhesive replace solder for the Pb-free world.

Wayne Thayer


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of R Sedlak
Sent: Thursday, April 09, 2009 3:06 PM
To: [log in to unmask]
Subject: Re: [TN] Friday Theorizing

Bob:  Remember there is no such thing as an oxide-free Tin surface, that is more than a few seconds old, and the older the surface, the thicker the oxide.  I suspect strongly that bond strength is going to very related to oxide thickness, no matter the adhesive composition.
It might even be worth considering some sort of oxide removal, even abrasive, before applying adhesive.
Rudy Sedlak
RD Chemical Company

--- On Thu, 4/9/09, bob wettermann <[log in to unmask]> wrote:

From: bob wettermann <[log in to unmask]>
Subject: [TN] Friday Theorizing
To: [log in to unmask]
Date: Thursday, April 9, 2009, 8:17 AM

Dear Technetters:

Has anyone done any adhesion testing of a 2um tin-electrocoated surface (copper carrier) to FR-4? How about a 0.100um tin electrocoated surface? Can someone theorize on which might give better adhesion using a 2-part epoxy?

Regards

 Bob Wettermann
BEST
PH 847-767-5745

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