Hello
 
When carrying out a rework or repair of a RoHS Compliant PWA, I have been using Lead Free Solder, Alloy Designation SAC 305, RS Stock Number 445-5858, for Hand Soldering operations.  Given that Lead Free Solder has a higher melting point than Tin Lead Solder, the Manufacturer of this has suggested that temperature of the Soldering Tip used in conjunction with it, should be between 350°C and 370°C for effective results.  However, with regards to Multilayer Ceramic Capacitors, this conflicts with the advice published on page 97 of AVX’s Surface Mounting Guide, which recommends Hot Air Reflow as the preferred rework method; and to a lesser extent, section 3.3 of Yageo’s MLCC Application Manual.
 
Given that in a lot of instances Hand Soldering is the only practical method, does anyone know of a technique where it can safely be employed for Multilayer Ceramic Capacitor rework, using Lead Free Solder?
 
Thanks
 
James Liddle
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