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Subject:	Re: Component stacking
From:	Guy Ramsey <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Guy Ramsey <[log in to unmask]>
Date:	Mon, 27 Apr 2009 06:17:45 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (43 lines)

We do this all the time with capacitors mostly. Print paste, place, dispense
paste, hand-place, reflow. No need to hand solder after reflow. 
I do agree with the observation about power handling. It is probably not
doubled. 

Guy

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Cindy S. Bohler
Sent: Friday, April 24, 2009 6:35 PM
To: [log in to unmask]
Subject: [TN] Component stacking

These are 2515 resitors stacked.  Has anyone ever tried this or seen it
done?  
We would paste and reflow the bottom one, as normal.  Then we would solder 
the top one to the bottom one with wire and then epoxy the two of them 
together.  Any thoughts or suggestions?

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