Hello technet
I am reviewing an application involving PoP (14mm package on package)
placed on the side A of the board, side B involves placement of multiple SMT
connectors (USB etc) therefore it's necessary to process them last.
My question is whether anyone sees a problem with the PoP device on side A
going through a 2nd time reflow during side B processing? Would I need to
utilize a reflow carrier to shield side A to avoid secondary reflow of the PoP
device?
Any input is appreciated. Thanks.
Peter
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