LISTSERV - TECHNET Archives - LISTSERV.IPC.ORG

TECHNET Archives

April 2009

TechNet@IPC.ORG

	LISTSERV Archives
	TECHNET Home
	TECHNET April 2009

	Log In
	Register

	Subscribe or Unsubscribe

	Search Archives

Options:	Use Monospaced Font Show Text Part by Default Show All Mail Headers
Message:	[<< First] [< Prev] [Next >] [Last >>]
Topic:	[<< First] [< Prev] [Next >] [Last >>]
Author:	[<< First] [< Prev] [Next >] [Last >>]

Subject:	Re: Gold/Tin Intermetallics, why are we afraid?
From:	Vladimir Igoshev <[log in to unmask]>
Reply To:	[log in to unmask]
Date:	Tue, 14 Apr 2009 21:07:36 +0000
Content-Type:	text/plain
Parts/Attachments:	text/plain (1 lines)

Hi Inge,



Yes, the intermetallics itself is strong, BUT it doesn't count, as all failures I've seen goes at the tin/intermetallics interface. The larger were the platelets, the worse it looked.



Regards,



Vladimir

------Original Message------

From: Inge

Sender: TechNet

To: [log in to unmask]

ReplyTo: TechNet E-Mail Forum

ReplyTo: Inge

Sent: Apr 14, 2009 16:55

Subject: [TN] Gold/Tin Intermetallics, why are we afraid?



These infamous IMCs are like parias or ghosts in most people's mind in our 

business. I shocked our production guys recently by giving the advice to let 

the boards go on. Large crystals and bad looking. But I always  try to avoid 

exaggerations. If no serious temp changes are predicted, nor any severe 

power switching, why rework and risk introducing failures?  The actual 

components were very hard to rework, the cost had been unacceptable. I can 

see many of you get  the coffee wrong. I don't mean to spread quality 

distractions, I talk about very few boards and a unique situation. My 

statement was based on the fact that a gold tin intermetallic bond is 

extremly strong and can last long, if not exposed to what I pointed at 

earlier. I expect to be hammered down in the shop floor until only the nose 

is visible....



Inge



---------------------------------------------------

Technet Mail List provided as a service by IPC using LISTSERV 15.0

To unsubscribe, send a message to [log in to unmask] with following text in

the BODY (NOT the subject field): SIGNOFF Technet

To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)

To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest

Search the archives of previous posts at: http://listserv.ipc.org/archives

Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815

-----------------------------------------------------







SENTEC

11 Canadian Road, Unit 7.

Scarborough, ON M1R 5G1

Tel: (416) 899-1882

Fax: (905) 882-8812

www.sentec.ca

ATOM RSS1 RSS2

LISTSERV.IPC.ORG