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Date: | Mon, 13 Apr 2009 09:49:55 -0700 |
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http://www.merix.com/HDI+Structures.aspx?id=3&rid=
Merix has some pretty good papers.
IPC-4761 is pretty good as well
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Kevin Glidden
Sent: Monday, April 13, 2009 9:45 AM
To: [log in to unmask]
Subject: [TN] Info on LPI tenting of vias, both sides
Hello everyone,
I am looking for information on the potential pitfalls of using LPI via
tenting on both sides, leaving an air pocket in the vias. Application is
NOT Pb-Free.
I located this article description, and wanted to see if anyone had it, but
other information, inputs, or articles are also welcome:
Title: An Evaluation of Via Hole Tenting with Solder Mask Designed to Pass
MIL-P-55110D Thermal Shock Requirements
Author(s): J.J. Davignon, F. Gray
Journal: <http://www.emeraldinsight.com/0305-6120.htm> Circuit World
Thanks!
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Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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