OK, no oxide binding. Still I'm curious. What's the purpose of bonding tin
to glass-epoxy? Maybe better to deposit a 'tin primer' layer directly on the
FR4 (vacuum or sputter or CVD) and fuse the foil and board together with a
suitable weight and use a batch oven. You may need activate the FR4 surface
before the above process. N.b. you must use a tin alloy higher than the one
for soldering components afterwards. Or maybe you use conductive epoxy?
Strange things you are mixing with....
Inge
----- Original Message -----
From: "bob wettermann" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, April 09, 2009 7:08 PM
Subject: Re: [TN] Friday Theorizing
> All:
>
> The copper is 1 oz copper used in PCB fab. The tin is plated onto both
> sides.
>
> The adhesive system is a 2part epoxy-resin system (Loctite).
>
> I am trying to precict which system will provide better adhesion???
>
> Thanks
>
> Bob Wettermann
> PH 847-767-5745
>
>
>
>
> ________________________________
> From: Inge <[log in to unmask]>
> To: [log in to unmask]
> Sent: Thursday, April 9, 2009 11:15:28 AM
> Subject: Re: [TN] Friday Theorizing
>
> The correct name of the (vintage) machine is Sebastian stud tester. It's
> probably followed by a number of more modern ones. From Dage, for
> instance.
> Inge
>
>
> ----- Original Message ----- From: "Inge" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Thursday, April 09, 2009 6:01 PM
> Subject: Re: [TN] Friday Theorizing
>
>
>> Bob,
>>
>> why so thin Tin? And no barrier? What's the purpose? And what do you
>> mean with a 'carrier' ?
>> When testing conductor adhesion, we simple make a board sample with a
>> number of copper traces, then cut it so we get a large number of square
>> pieces approx. 1x1 inch. Next, we apply a solder paste dot on the center
>> of each square, size about 2 mm. This is followed by soldering kind of
>> needles with a round plate to each square sample. Vapour phase or oven
>> soldered. Finally, the samples are placed in a Sebastian pulling
>> machine's chuck and depress 'pull'. The machine increases the pull force
>> until the plate headed needle separates from the FR4 matrix and the value
>> is presented on the display. Years ago, we did this test frequently on
>> board coupons, but there is little interest in doing it today, because
>> adhesion problems are very rare.
>>
>> Inge
>>
>>
>> ----- Original Message ----- From: "bob wettermann" <[log in to unmask]>
>> To: <[log in to unmask]>
>> Sent: Thursday, April 09, 2009 5:17 PM
>> Subject: [TN] Friday Theorizing
>>
>>
>>> Dear Technetters:
>>>
>>> Has anyone done any adhesion testing of a 2um tin-electrocoated surface
>>> (copper carrier) to FR-4? How about a 0.100um tin electrocoated surface?
>>> Can someone theorize on which might give better adhesion using a 2-part
>>> epoxy?
>>>
>>> Regards
>>>
>>> Bob Wettermann
>>> BEST
>>> PH 847-767-5745
>>>
>>> ---------------------------------------------------
>>> Technet Mail List provided as a service by IPC using LISTSERV 15.0
>>> To unsubscribe, send a message to [log in to unmask] with following text
>>> in
>>> the BODY (NOT the subject field): SIGNOFF Technet
>>> To temporarily halt or (re-start) delivery of Technet send e-mail to
>>> [log in to unmask]: SET Technet NOMAIL or (MAIL)
>>> To receive ONE mailing per day of all the posts: send e-mail to
>>> [log in to unmask]: SET Technet Digest
>>> Search the archives of previous posts at:
>>> http://listserv.ipc.org/archives
>>> Please visit IPC web site
>>> http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
>>> information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
>>> ext.2815
>>> -----------------------------------------------------
>>
>> ---------------------------------------------------
>> Technet Mail List provided as a service by IPC using LISTSERV 15.0
>> To unsubscribe, send a message to [log in to unmask] with following text in
>> the BODY (NOT the subject field): SIGNOFF Technet
>> To temporarily halt or (re-start) delivery of Technet send e-mail to
>> [log in to unmask]: SET Technet NOMAIL or (MAIL)
>> To receive ONE mailing per day of all the posts: send e-mail to
>> [log in to unmask]: SET Technet Digest
>> Search the archives of previous posts at:
>> http://listserv.ipc.org/archives
>> Please visit IPC web site
>> http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
>> information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
>> ext.2815
>> -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-615-7100 ext.2815
> -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-615-7100 ext.2815
> -----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|