OK, no oxide binding. Still I'm curious. What's the purpose of bonding tin to glass-epoxy? Maybe better to deposit a 'tin primer' layer directly on the FR4 (vacuum or sputter or CVD) and fuse the foil and board together with a suitable weight and use a batch oven. You may need activate the FR4 surface before the above process. N.b. you must use a tin alloy higher than the one for soldering components afterwards. Or maybe you use conductive epoxy? Strange things you are mixing with.... Inge ----- Original Message ----- From: "bob wettermann" <[log in to unmask]> To: <[log in to unmask]> Sent: Thursday, April 09, 2009 7:08 PM Subject: Re: [TN] Friday Theorizing > All: > > The copper is 1 oz copper used in PCB fab. The tin is plated onto both > sides. > > The adhesive system is a 2part epoxy-resin system (Loctite). > > I am trying to precict which system will provide better adhesion??? > > Thanks > > Bob Wettermann > PH 847-767-5745 > > > > > ________________________________ > From: Inge <[log in to unmask]> > To: [log in to unmask] > Sent: Thursday, April 9, 2009 11:15:28 AM > Subject: Re: [TN] Friday Theorizing > > The correct name of the (vintage) machine is Sebastian stud tester. It's > probably followed by a number of more modern ones. From Dage, for > instance. > Inge > > > ----- Original Message ----- From: "Inge" <[log in to unmask]> > To: <[log in to unmask]> > Sent: Thursday, April 09, 2009 6:01 PM > Subject: Re: [TN] Friday Theorizing > > >> Bob, >> >> why so thin Tin? And no barrier? What's the purpose? And what do you >> mean with a 'carrier' ? >> When testing conductor adhesion, we simple make a board sample with a >> number of copper traces, then cut it so we get a large number of square >> pieces approx. 1x1 inch. Next, we apply a solder paste dot on the center >> of each square, size about 2 mm. This is followed by soldering kind of >> needles with a round plate to each square sample. Vapour phase or oven >> soldered. Finally, the samples are placed in a Sebastian pulling >> machine's chuck and depress 'pull'. The machine increases the pull force >> until the plate headed needle separates from the FR4 matrix and the value >> is presented on the display. Years ago, we did this test frequently on >> board coupons, but there is little interest in doing it today, because >> adhesion problems are very rare. >> >> Inge >> >> >> ----- Original Message ----- From: "bob wettermann" <[log in to unmask]> >> To: <[log in to unmask]> >> Sent: Thursday, April 09, 2009 5:17 PM >> Subject: [TN] Friday Theorizing >> >> >>> Dear Technetters: >>> >>> Has anyone done any adhesion testing of a 2um tin-electrocoated surface >>> (copper carrier) to FR-4? How about a 0.100um tin electrocoated surface? >>> Can someone theorize on which might give better adhesion using a 2-part >>> epoxy? >>> >>> Regards >>> >>> Bob Wettermann >>> BEST >>> PH 847-767-5745 >>> >>> --------------------------------------------------- >>> Technet Mail List provided as a service by IPC using LISTSERV 15.0 >>> To unsubscribe, send a message to [log in to unmask] with following text >>> in >>> the BODY (NOT the subject field): SIGNOFF Technet >>> To temporarily halt or (re-start) delivery of Technet send e-mail to >>> [log in to unmask]: SET Technet NOMAIL or (MAIL) >>> To receive ONE mailing per day of all the posts: send e-mail to >>> [log in to unmask]: SET Technet Digest >>> Search the archives of previous posts at: >>> http://listserv.ipc.org/archives >>> Please visit IPC web site >>> http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional >>> information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 >>> ext.2815 >>> ----------------------------------------------------- >> >> --------------------------------------------------- >> Technet Mail List provided as a service by IPC using LISTSERV 15.0 >> To unsubscribe, send a message to [log in to unmask] with following text in >> the BODY (NOT the subject field): SIGNOFF Technet >> To temporarily halt or (re-start) delivery of Technet send e-mail to >> [log in to unmask]: SET Technet NOMAIL or (MAIL) >> To receive ONE mailing per day of all the posts: send e-mail to >> [log in to unmask]: SET Technet Digest >> Search the archives of previous posts at: >> http://listserv.ipc.org/archives >> Please visit IPC web site >> http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional >> information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 >> ext.2815 >> ----------------------------------------------------- > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > ----------------------------------------------------- > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------