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Date: | Thu, 15 Jan 2009 09:26:40 +0800 |
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Hi Steve,
Please help to download these pictures TechNet, thanks.
Hi All experts,
Testing (combine test of 16G at 85 oC) was performed on
evaluation boards with under-filled BGAs. Open issue (cracks) was
detected only at some corners of the BGA (35x35mm with 1156 balls) after
the test. Lead-free process and PCB with ENIG surface finish. Peak
temperature is 248 oC with a 65 sec above 217 oC.
FYI, the service lab has not come out a report.
What are the possible causes? (CET mismatches, Lead-free
alloy related, material, processes)
Thank you in advance.
Regards
GA Tan
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