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October 2008

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Subject:
From:
Yong How GOH <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Yong How GOH <[log in to unmask]>
Date:
Tue, 7 Oct 2008 10:38:48 +0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (133 lines)
Hi Anand,

You may wish to refer to IPC-2221.
There's a table which lists the min. thickness for the different surface
plating requirements. 

Hope this is what you are looking for.

Regards
YH Goh

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of anand paliwal
Sent: Friday, October 03, 2008 10:40 PM
To: [log in to unmask]
Subject: Re: [TN] Electrolytic (Flash) Nickel Gold Finish

This is reply from our Fabricator from china even from the COB
fabricator
that it is difficult and they got feedback from different client so
suggested not to use Alumin. for ENIG. so i am moving to wards Flash
gold.
but nobody is commenting on the thicknesses for Flash gold.
Please do comments on what should be thickness of gold and nickel in
Flash
gold plating ?


Thanks
Regards,
Anand


On Thu, Oct 2, 2008 at 1:00 AM, Hernefjord Ingemar <
[log in to unmask]> wrote:

> Anand,
> who said aluminum is not viable for ENIG? We have produced some
million
> boards with Al wedge bonding on ENIG. In fact, you bond on the
underlying
> nickel. If the gold is thin, which is the case with ENIG, no hazardous
IMCs
> will grow.
> Inge
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Anand
> Sent: den 1 oktober 2008 23:03
> To: [log in to unmask]
> Subject: [TN] Electrolytic (Flash) Nickel Gold Finish
>
> Hi All,
>
> I want to use Alluminum WEDGE wire bonding for COB.
> as the ENIG is suitable only for Gold Wire Bonding .....! which i
don't
> want.
>
> I thought about Electrolytic (Flash) Nickel Gold Finish. as alluminum
wire
> bond can be used.
>
> but i don;t know the recommended thickness of nickel and Gold for
>
> A) Electrolytic ?????? I didn't found any ipc std for this ?
>
> B) Can any ONE please guide me for the thickness of this plating....!
>
> C) again as there is no phosphurus used in electrlytic process how can
we
>    prevent the corrosion for this plating ?
>
>  thanks and eagerly waiting for the answer on above three questions
.....
>
>
>
> Regards,
> Anand
>
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-- 
With Best Regards,
Anand Paliwal

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