Hi Werner,
Thank for the link. Good write out!
Regards
GA Tan
________________________________
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Monday, 27 October 2008 2:06 AM
To: Tan Geok Ang; [log in to unmask]; [log in to unmask]
Subject: Re: [TN] Underfill, Cause
Nee hao GA Tan,
The Tg of the underfill is not much of a concern; the critical properties are the CTE over the application T-range and the modulus of elasticity. It has also been shown by work done at Motorola that slow curing underfills [at least some] do not give much reliability improvement at low failure probabilies [that is the failure distributions become very wide]; whereas snap-cure underfills produce tight failure distributions.
You might want to take a look at my reliability column: Engelmaier, W., “Reliability Improvement with Underfill,” Global SMT & Packaging, Vol. 6, No. 3, March 2006, pp. 66-67.
Regards,
Werner Engelmaier
可靠性先生
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com
**************
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