You can request a copy of any of the lead-free reports from NPL from Ling
Zou [log in to unmask] 

It's not as easy to give links any more on the web site.

The report is report is commonly referred to as the Transition Report. We
made up a new list of all the lead-free reports that are available to
industry
 
Many thanks

Bob Willis
2 Fourth Ave, Chelmsford, Essex, CM1 4HA England
Tel: (44) 1245 351502
Fax: (44) 1245 496123
Mobile: 07860 775858
 
www.ASKbobwillis.com
New Bob Willis "Printed Board Inspection & Quality Control Workshop" 24th
March www.ASKbobwillis.com/faworkshops.pdf
 
"Troubleshooting Your Assembly Yields Workshop" 25th March
www.ASKbobwillis.com/faworkshops.pdf
 
Book Bob's "Step by Step Failure Analysis Workshop" 22nd April
www.ASKbobwillis.com/faworkshops.pdf
 
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee Whiteman
Sent: 21 October 2008 17:10
To: [log in to unmask]
Subject: Re: [TN] Lead Free BGA'S

Rex,

Do you have a hyperlink to the report or know where I can get a copy of
it?

Thanks.

Lee Whiteman, PMP
Senior Member Engineering Staff
L-3 Communications East
Telephone: (856) 338-3508
FAX: (856) 338-2906
E-Mail: [log in to unmask]
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Rex Waygood
Sent: Tuesday, October 21, 2008 12:09 PM
To: [log in to unmask]
Subject: Re: [TN] Lead Free BGA'S

There is an NPL report that shows that this could be more reliable in
thermal cycle than either all SAC or all SnPb with the balls having
reflowed to produce a 'uniform' alloy. Obviously making an assumption
that some other BGA, thermal cycle routine, pad size etc will be the
same has risks but it was a good report. From memory the NPL under BGA
temp was 217C.


Rex Waygood
Technical Manager
 
PartnerTech Poole Ltd 
Benson Road
Poole
Dorset BH17 0RY
United Kingdom
 
Tel: +44 (0)1202 674333
Fax: +44 (0)1202 678028
DDI: +44 (0)1202 338222
Mob: +44 (0)7887 997403
 
[log in to unmask]
www.PartnerTech.co.uk

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Foster
Sent: 21 October 2008 16:21
To: [log in to unmask]
Subject: [TN] Lead Free BGA'S

Our assembly house recently assembled some boards with Lead Free BGA's
for us and when I asked them if they used a lead free process they
responded with.

We use leaded solder (Sn63Pb37) with a hybrid oven profile to
accommodate the lead-free BGA. I hope this answers your question. Please
let me know if you have any more questions."
Is this a common process, is this a reliable process

Any input is appreciated

Thank You
John Foster


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