Hilal Gudal has published the results of her work at Unisys using SnBi to  
develop a wave soldering process to manufacture a high density mainframe  
computer board. The board was about 2' x 2', >50 layers, 40 lbs., 210 custom  PGAs 
plus other components for >90,000 solder joints, of which 52,000 were  hidden. 
The PGAs were SnBi tinned prior to assembly. Assembly process included a  
synthetic activated (SA) flux, SnBi wave solder solder, batch solvent cleaning.  
The references include the DOE and experimental results.
 
The published references are:
 
Hilal Erdogan Gudal and Richard R. Carlson, Unisys Corp., "Low Temperature  
Lead-Free Wave Soldering for Complex PCBs," EP&P, pp 28-32, Sept. 1992
 
Hilal Gudal, "Low Temperature Soldering of Dense Printed Circuit Boards,"  
NEPCON West Proceedings (Vol. II, Tech. Session 49) pp 1823-1831, February, 1990 
  

Bill  Kenyon
Global Centre Consulting
3336 Birmingham Drive
Fort Collins, CO  80526
Tel: 970.207.9586   Cell:  970.980.6373

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