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Date: | Thu, 9 Oct 2008 13:08:28 -0400 |
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Paymon,
I would be VERY curious to know how anyone could come up with the numbers from that kind of EDS analysis.
Regards,
Vladimir
----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Thu Oct 09 09:57:20 2008
Subject: [TN] PCB pad non-wetting issues
Hello All,
We are experiencing a pad non-wetting issue for the though-hole
component pads ONLY! The PCB goes through few heat cycles with top and
bottom side assembly during at SMT process and then through-hole
assembly at wave process. The problem is found at Wave process. The Pb
solder does not wet to the through-hole component pads on the solder
side only! An SEM/EDS evaluation revealed high concentration of P in the
Nickel and Nickel/Tin intermetalic layer of 11% to 21%. I would like to
ask anyone if they have experienced a similar defect in the past. What
is the Root Cause?
Thank you in advance,
Paymon
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