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Date: | Fri, 10 Oct 2008 09:23:04 +0800 |
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The question is why it only happened on the solder side pads (believed
that solder flow through PTH barrel and fillets formed on the
component/top side of the board). Either black pad issue on the solder
side or the wetting/contact time is too long at wave soldering process.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Paymon Sani
Sent: Thursday, 9 October 2008 10:54 PM
To: [log in to unmask]
Subject: Re: [TN] PCB pad non-wetting issues
No, this is a good suggestion. I will propose it based on the PCB
pricing and failure rate.
Thank you,
Paymon
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: October 9, 2008 10:25 AM
To: [log in to unmask]
Subject: Re: [TN] PCB pad non-wetting issues
Have you tried running a bare board through to confirm/eliminate the
heating
cycles?
John Burke
(408) 515 4992
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Paymon Sani
Sent: Thursday, October 09, 2008 6:57 AM
To: [log in to unmask]
Subject: [TN] PCB pad non-wetting issues
Hello All,
We are experiencing a pad non-wetting issue for the though-hole
component pads ONLY! The PCB goes through few heat cycles with top and
bottom side assembly during at SMT process and then through-hole
assembly at wave process. The problem is found at Wave process. The Pb
solder does not wet to the through-hole component pads on the solder
side only! An SEM/EDS evaluation revealed high concentration of P in the
Nickel and Nickel/Tin intermetalic layer of 11% to 21%. I would like to
ask anyone if they have experienced a similar defect in the past. What
is the Root Cause?
Thank you in advance,
Paymon
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