IPC sells some photo CD ROM albums, there are 10 in total if you call IPC or
search the web site you will find them. They were produced to help people
make up training presentations etc.
One is specific to PCBs defects, others cover BGA, SMT, LGA/QFNs,
Conventional joints etc. They are also available in US from Automated
Learning, Electronics ca and SMTA.
Bob Willis
2 Fourth Ave, Chelmsford, Essex, CM1 4HA England
Tel: (44) 1245 351502
Fax: (44) 1245 496123
Mobile: 07860 775858
www.ASKbobwillis.com
New Bob Willis "Printed Board Inspection & Quality Control Workshop" 24th
March www.ASKbobwillis.com/faworkshops.pdf
"Troubleshooting Your Assembly Yields Workshop" 25th March
www.ASKbobwillis.com/faworkshops.pdf
Book Bob's "Step by Step Failure Analysis Workshop" 22nd April
www.ASKbobwillis.com/faworkshops.pdf
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Simonik, Dave R. (David)
Sent: 11 September 2008 18:24
To: [log in to unmask]
Subject: Re: [TN] Need Photos
Hi Alan;
The following was copied from our on line defect book.
DELAMINATION
330 000 Delamination charged to Oxide
When a core, panel, or circuit blisters or separates in the middle of
the thickness then it is called 330 DELAMINATION. It may show as small,
isolated opaque spots but it usually shows as large blister-like areas
either close to the surface or deep within the laminate. Usually a
noticeable bubble or mound is found over the point of delamination. This
differs from Measling in that measling has lots of small spots
concentrated in specific areas without any noticeable mounding.
In addition, when a Rigid-Flex product does not have the proper amount
of adhesion in the area of the flex cores, then it is also called
DELAMINATION.
This can occur due to insufficient cure of the resin, incorrect press
lamination parameters, or contamination on or between cores, prepreg or
foil.
This could occur on cores, panels or circuits as well as double sided
panels.
MEASLING
When a core, panel or circuit exhibits a whitish, opaque appearance that
follows the glass weave pattern then it is 334 MEASLING. This is
actually a microscopic separation of the resin from the glass bundles
that make up the glass fabric in the laminate.
This may be confused with Resin Starvation but it differs in the fact
that it is found in isolated spots rather than wider areas. If both
defects are present then it should be called out as Resin Starvation.
Measling differs from Delamination in that there is NO mounding or
blistering over these areas.
This could occur on cores, panels or circuits.
Dave Simonik
Process Technician
Sanmina SCI Corp.
Owego NY PCB Division
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Alan Davison
Sent: Thursday, September 11, 2008 2:08 PM
To: [log in to unmask]
Subject: Need Photos
I am looking for some good photos of delaminated and measled boards. If
you have any or know where to find some it would help me to put out a
growing fire with one of our customers.
Thanks
Alan Davison
Cascade Controls NW
[log in to unmask]<mailto:[log in to unmask]>
503.252.3116
16039 NE Cameron Blvd.
Portland. OR 97230
CONFIDENTIALITY
This e-mail message and any attachments thereto, is intended only for use by
the addressee(s) named herein and may contain legally privileged and/or
confidential information. If you are not the intended recipient of this
e-mail message, you are hereby notified that any dissemination, distribution
or copying of this e-mail message, and any attachments thereto, is strictly
prohibited. If you have received this e-mail message in error, please
immediately notify the sender and permanently delete the original and any
copies of this email and any prints thereof.
ABSENT AN EXPRESS STATEMENT TO THE CONTRARY HEREINABOVE, THIS E-MAIL IS NOT
INTENDED AS A SUBSTITUTE FOR A WRITING. Notwithstanding the Uniform
Electronic Transactions Act or the applicability of any other law of similar
substance and effect, absent an express statement to the contrary
hereinabove, this e-mail message its contents, and any attachments hereto
are not intended to represent an offer or acceptance to enter into a
contract and are not otherwise intended to bind the sender, Sanmina-SCI
Corporation (or any of its subsidiaries), or any other person or entity.
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
