John,

Did you hear back from Cliff as to when we would have our planning telecon?

Gary

John Perry wrote:
> Hello Everyone,
> 
> This is a reminder that the IPC-A-600 and IPC-6012 task groups will be meeting together on Sunday, September 21st from 8AM - 3PM in the Imagination Room of the Renaissance Hotel and Convention Center in Schaumburg, IL as part of IPC Midwest 2008.
> 
> Our meeting agenda will include:
> 
> 
> *         Review efforts to develop and expand on cap plating thickness and via fill requirements begun at IPC February 2008 Interim Meetings for IPC-6012C and IPC-A-600H
> 
> 
> *         Status of the IPC D-32 Thermal Stress Test Method Subcommittee effort to provide a drop in replacement for the 2.6.8E thermal stress method
> 
> 
> *         Continue work on developing lead-free acceptance criteria for printed boards (copper dissolution)
> 
> 
> *         Status report of the 5-32b Bare Board Cleanliness Assessment Task Group effort to develop an IPC-5704 specification for bare board cleanliness levels
> 
> Regards,
> 
> John Perry
> Technical Project Manager
> IPC
> 3000 Lakeside Drive # 309S
> Bannockburn, IL 60015
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> 1-847-597-2818 (P)
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> 1-847-615-7100 (Main)
> IPC Midwest Conference and Exhibition 2008<http://www.ipcmidwestshow.org/html/main/default.htm>
>