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Subject:	IPC-600-6012 Meeting at IPC Midwest
From:	John Perry <[log in to unmask]>
Reply To:	(Combined Forum of D-33a and 7-31a Subcommittees)
Date:	Mon, 8 Sep 2008 13:55:44 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (31 lines)

Hello Everyone,

This is a reminder that the IPC-A-600 and IPC-6012 task groups will be meeting together on Sunday, September 21st from 8AM - 3PM in the Imagination Room of the Renaissance Hotel and Convention Center in Schaumburg, IL as part of IPC Midwest 2008.

Our meeting agenda will include:


*         Review efforts to develop and expand on cap plating thickness and via fill requirements begun at IPC February 2008 Interim Meetings for IPC-6012C and IPC-A-600H


*         Status of the IPC D-32 Thermal Stress Test Method Subcommittee effort to provide a drop in replacement for the 2.6.8E thermal stress method


*         Continue work on developing lead-free acceptance criteria for printed boards (copper dissolution)


*         Status report of the 5-32b Bare Board Cleanliness Assessment Task Group effort to develop an IPC-5704 specification for bare board cleanliness levels

Regards,

John Perry
Technical Project Manager
IPC
3000 Lakeside Drive # 309S
Bannockburn, IL 60015
[log in to unmask]
1-847-597-2818 (P)
1-847-615-7105 (F)
1-847-615-7100 (Main)
IPC Midwest Conference and Exhibition 2008<http://www.ipcmidwestshow.org/html/main/default.htm>

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