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August 2008

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Subject:
From:
Steve Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steve Gregory <[log in to unmask]>
Date:
Mon, 18 Aug 2008 07:29:33 -0500
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text/plain
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Mornin' Inge!

Got your picture posted, but that's all the help I can offer...I know
nothing about wire bonding.

Your picture is here:

http://stevezeva.homestead.com/files/Wirebond.jpg

Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hernefjord Ingemar
Sent: Monday, August 18, 2008 4:13 AM
To: [log in to unmask]
Subject: [TN] Wire bonding gurus ohoy!


 Hi all,

will send a picture to Steve for getting help.
Thermosonic 25um gold balls don't stick to the thinfilm gold on a optic
chip.
2,500A Au over 400A Cr. Bad yield, many balls lift. No contaminations
found.
Despite I have the good fishbone, I can't find out why the odd pattern
under lifted bals.
A guess is that the capillary have to steep chamfer angle, so that the
U/S mechanical energy becomes concentrated in the middle. Anyone with
similar experience?

Inge

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